双面压接背板可靠性研究  

Reliability Research of the Dual-Side Press Fit Backpanel PCB

作　　者：任尧儒 王小平 REN Yao-ru;WANG Xiao-ping

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2018年第4期35-44,共10页Printed Circuit Information

摘　　要：在数据交换量日益膨胀的4G/5G通讯时代,双面压接高速背板方案能够很好的实现这种功能。双面压接背板在电镀过程中存在机械盲孔无铜、表面基材污染和孔壁耐热环境微裂纹等影响可靠性和表观的缺陷,因此经过机理分析和实验验证,通过工艺改良实现产品电气连接和可靠性提升,并保证批量可靠稳定制作。In the 4th and 5th generation communication, the data translate rate is required. The high speed dual-side press fit Backpanel can achieve this function, Because of hole plating voids surface contamination and plated hole copper crack, it is necessary to find and confirm the key factors via principle analysis and experiments to improve the products electrical and visual reliability and fully ensure mass produce.

关 键 词：双面压接 背板 孔内无铜 板面污染 孔壁冲击裂纹 

分 类 号：TN41[电子电信—微电子学与固体电子学]