非平稳工况下功率半导体器件结温管理技术综述  

Review on Junction Temperature Management of Power Semiconductor Devices Under Power Fluctuation Condition

作　　者：周雒维[1] 王博[1] 张益 谌思 ZHOU Luowei;WANG Bo;ZHANG Yi;CHEN Si(State Key Laboratory of Power Transmission Equipment ＆ System Security and New Technology （Chongqing University）, Shapingba District, Chongqing 400044, Chin)

机构地区：[1]输配电装备及系统安全与新技术国家重点实验室(重庆大学)

出　　处：《中国电机工程学报》2018年第8期2394-2407,共14页Proceedings of the CSEE

基　　金：国家自然科学基金重点项目(51137006);重庆市2015年研究生科研创新项目基金(CYB15034)~~

摘　　要：结温管理技术可以有效地降低功率半导体器件承受的热载荷,提高功率半导体器件的期望寿命,是近期电力电子学科研究的热点之一。为此,概述国内外结温平滑方法的研究现状,根据补偿损耗和降低损耗两种不同的平滑结温思路,对现有结温平滑方法进行分类,总结每类方法在应用时存在的主要问题;概述结温管理系统的研究现状,分析结温管理系统目前的研究难点;在对现有寿命评估方法概述的基础上,总结出一种评价结温管理效果的方法;根据该评价方法,对两类结温平滑控制方法效果进行分析和讨论,得出基于补偿损耗的结温管理方法可能对寿命期望产生负面影响的结论。Recently, junction temperature management technology is a hot topic of power electronic research which can effectively reduce the thermal load of power semiconductor devices in order to improve the life expectancy. Therefore, the state-of-the-art junction temperature smoothing methods were thoroughly reviewed. The existing smoothing methods were classified according to the basic ideas of junction temperature management that are the loss compensation and the loss reduction, and the main problems of each method are summarized; the research status of temperature management system was summarized with the research difficulties; the main methods of life assessment are reviewed, and accordingly a method to evaluate the effect of junction temperature management was summarized. According to the evaluation method, the effect of two kinds of smoothing methods was analyzed and discussed. The conclusion indicated that the method of the loss compensation may have a negative impact on the life expectancy of power semiconductor devices.

关 键 词：非平稳工况 功率半导体器件 结温管理 期望寿命 

分 类 号：TM85[电气工程—高电压与绝缘技术]