铝包铜复合导电头的界面组织及失效机制  

Interface Structure Analysis and Failure Mechanism of Aluminum Cladding Copper Conductive Head

作　　者：魏艳妮[1] 罗永光 曲洪涛 谭世友[1] 梁淑华[1] Wei Yanni;Luo Yongguang;Qu Hongtao;Tan Shiyou;Liang Shuhua(Department of Materials Science and Engineering, Xi＇an University of Technology;Yunnan Chihong Zinc and Germanium Co., Ltd.)

机构地区：[1]西安理工大学材料科学与工程学院 [2]云南驰宏锌锗股份有限公司

出　　处：《特种铸造及有色合金》2018年第4期421-425,共5页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(51371139);云南驰宏锌锗股份有限公司湿法炼锌阴极导电头界面失效原因及其调控机制研究资助项目;中国博士后科学基金资助项目(2016M592823);国家自然科学青年基金资助项目(51701154);陕西省教育厅专项科研计划资助项目(17JK0563)

摘　　要：采用固-液复合方法制备了铝包铜复合导电头,利用扫描电镜(SEM)及能谱仪(EDS),对Cu/Al复合界面的微观组织形貌及相组成进行分析,并采用剪切试验、微观硬度测试、涡流导电仪及电化学测试对Cu/Al复合界面的结合强度、微观硬度、界面导电性及耐腐蚀性能进行了研究。结果表明,固-液复合法制备的铝包铜导电头Cu/Al界面由大量金属间化合物与Al基体的混合物相组成,界面过渡层平均宽度约为500μm,存在分布不均匀且尺寸较大的类孔型缺陷及细小的裂纹,界面连接强度较低,为6~10 MPa,界面耐腐蚀性和导电性较差。导电头使用前后Cu/Al异质界面组织及性能对比分析表明,铝包铜导电头界面失效的主要原因是界面大量缺陷和较厚的界面过渡层致使界面处导电性变差,从而在通电时电阻发热严重恶化界面,最终导致失效。The microstructure and phase composition of Cu/Al composite interface were analyzed by scanning electron microscopy（SEM）and energy dispersive spectroscopy（EDS）for Cu/Al composite conductive head prepared by solid-liquid composite method.The shearing bond strength,microhardness,interfacial conductivity and corrosion resistance of the Cu/Al composite interface were expounded by means of shearing test,microhardness test,eddy current conductivity meter and electrochemical tests.The results reveal that the interface of Cu/Al composite interface is composed of a mixture of a large number of intermetallic compounds and the Al matrix,and the average width of the interfacial transition layer reaches approximately 500μm,in which there exists uneven distribution and large size Hole-like defects and small cracks,so interface bonding strength is only 6-10 MPa.In addition,corrosion resistance and electric behavior exhibit poor.The comparison of the microstructure and properties of the Cu/Al interface before and after the use of the conductive head shows that the main failure mechanism of the interface of the aluminum-clad conductive head is attributed to the large number of defects in the interface and the thick interface layer.When power is on,the electric resistance heats up severely,which further deteriorates the interface and eventually leads to failure.

关 键 词：固-液复合 导电头 微观组织 界面性能 

分 类 号：TG174.44[金属学及工艺—金属表面处理] TG146[金属学及工艺—金属学]