单辊急冷甩带法制备Ag-22.4Cu-20Sn钎料合金组织性能研究  

Study on Microstructure and Properties of Ag-22.4Cu-20Sn Solder Alloy Prepared by Single-roller Rapid Cooling Melt Spinning Technology

作　　者：赵晓然[1] 许昆 刘毅 武海军 李强 ZHAO Xiaoran;XU Kun;LIU Yi;WU Haijun;LI Qiang(Kunming Institute of Precious Metals, Kunming 650000, China;Sino-platinum Metals Co., Ltd., Kunming 650106, China)

机构地区：[1]昆明贵金属研究所,云南昆明650000 [2]云南贵研铂业股份有限公司,云南昆明650106

出　　处：《热加工工艺》2018年第7期58-61,共4页Hot Working Technology

摘　　要：为解决Ag-Cu-Sn系钎料合金显微组织粗大的问题,并改善其力学性能和钎焊性能,采用单辊急冷甩带法制备厚0.2 mm,宽12 mm的Ag-22.4Cu-20Sn钎料薄带,通过使用差示扫描量热仪、X射线衍射仪、SEM及能谱仪对该钎料薄带的熔化特征、相组成以及显微组织进行了分析。采用Ag-22.4Cu-20Sn钎料薄带进行铜板和镍板的铺展性试验和搭接钎焊试验。结果表明：单辊急冷甩带法制备的Ag-22.4Cu-20Sn钎料薄带由亚稳相α-Ag、Ag_4Sn、Cu_（41）Sn_（11）金属间化合物组成,钎料合金显微组织为细小的等轴晶组织。Ag-22.4Cu-20Sn钎料薄带在铜板、镍板上润湿良好。钎接接头均形成了冶金结合,接头拉抗剪强度较高,均满足工程实际要求。In order to solve the problem of Ag-Cu-Sn series solder alloy＇s coarse microstructure and improve the mechanical properties and brazing properties,the Ag-22.4Cu-20Sn solder ribbon with the thickness of 0.2 mm and the width of 12 mm was prepared by single-roller rapid cooling melt spinning technology.The melting behavior,phase composition and microstructure of the solder ribbon were analyzed by using differential scanning calorimeter,X-ray diffractometer,SEM and energy spectrometer.The spreading test and lap brazing test of copper plate and nickel plate were carried out by using the Ag-22.4Cu-20Sn solder ribbon.The results show that the the solder ribbon prepared by the single-roller melt spinning technology is composed ofα-Ag,Ag_4Sn and Cu_（41）Sn_（11）intermetallic compounds.The microstructure of the solder alloy is fine equiaxed crystal structure.The Ag-22.4Cu-20Sn solder ribbon is well wetted on the copper and nickel plates.The brazed joints form metallurgical bonding,and the tensile strengths of the joints are good,which meets the engineering requirements.

关 键 词：单辊法 Ag-22.4Cu-20Sn钎料 显微组织 钎焊性能 

分 类 号：TG425[金属学及工艺—焊接]