印制电路板孔金属化工艺中活化液的研制  

Preparation of Activating Solution in Printed Circuit Board Hole Metallization Process

作　　者：吴蓉[1] 吴道新[1] 李丹[1] 肖忠良[1] 王毅玮 沙煜 周光华 WU Rong;WU Dao-xin;LI Dan;XIAO Zhong-liang;WANG Yi-wei;SHA Yu;ZHOU Guang-hua(Institute of Chemical and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China;Aoshikang Technology Co.,Ltd., Yiyang 413000, China)

机构地区：[1]长沙理工大学化学与生物工程学院,湖南长沙410114 [2]奥斯康科技股份有限公司,湖南益阳413000

出　　处：《精细化工中间体》2018年第1期61-65,共5页Fine Chemical Intermediates

基　　金：湖南省战略性新兴产业科技攻关与重大成果转化项目(2015GK10460);国家工业信息化部;财经部绿色制造系统集成项目"高精密印制电路板绿色关键工艺系统集成";长沙市科技计划项目(kq1701077;kq1706063)

摘　　要：以氯化钯、氯化亚锡以及氯化钠为原料,采用"三步法"合成一种低浓度的胶体钯活化液(以PdCl_2计:0.18 g·dm^(-3))。通过诱导时间和完全镀覆时间、电位曲线探究n(Sn)/n(Pd)、反应温度、熟化温度以及氯化钠的质量浓度对胶体钯分散性以及活性的影响。实验结果表明:当n(Sn)∶n(Pd)=50∶1,反应温度80±2℃,熟化温度90±2℃,氯化钠质量浓度80 g·dm^(-3)时,优化了钯浓度为100×10-6的胶体钯活化液的配方。A low-concentration colloidal synthesized palladium activation solution with palladium concentration was a three-step method using palladium chloride, stannous chloride and sodium chloride as raw materials. The factors including the ratio of n（Sn）/n（Pd）, reaction temperature, aging temperature and mass concentration of sodium chloride affecting the dispersion and activity of colloidal palladium were investigated by induction time, complete plating time and potential curve. The optimum formulation conditions for the colloidal palladium activation solution are as following： a mole ratio of 50：1 for SnCl2 and Pd Cl2, reaction temperature is of 80±2℃, curing temperature is of 90±2℃, and sodium chloride concentration is of 80 g· dm-3.

关 键 词：胶体钯 低质量浓度 活性 

分 类 号：TG174.42[金属学及工艺—金属表面处理]