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作 者:刘智敏 秦浩 王洋洋 周明军 郝玉芳 LIU Zhi-min;QIN Hao;WANG Yang-yang;ZHOU Ming-jun;HAO Yu-fang(The 49th Research Institute, China Electronics Technology Group Corporation, Harbin 150001, China)
机构地区:[1]中国电子科技集团公司第四十九研究所,黑龙江哈尔滨150001
出 处:《传感器与微系统》2018年第4期38-40,共3页Transducer and Microsystem Technologies
摘 要:针对氧化锆(ZrO_2)氧传感器封接料失效机理,提出了在传感器加热电路上增加预热功能,通过仿真和试验的方法验证了改进措施的有效性。仿真分析的结果表明:温度变化幅度为200℃时应力状态较温度变化400℃时的应力降低幅度约为40%。通过试验样件验证表明,传感器在进行了576次启动热应力试验后,封接料状态良好,未开裂,表明加热电路增加预热功能后降低了热应力冲击强度,增加预热电路后,传感器有效避免了使用中出现封接料开裂故障。According to failure mechanism of sealing material of ZrO2 oxygen sensor,preheating function is put forward to add in sensor heating circuit. The effectiveness of the improved measure is verified by simulation and experiment.The results of simulation analysis show that the stress is reduced about 40% from temperature change range 200 ℃ to 400 ℃.The sample test results show that,after 576 times starting thermal stress tests are carried out,the sealing material is in good condition,without cracks.The results show that heating circuit can reduce the thermal stress impact strength after adding preheating function,which can avoid sealing material cracking in sensor usage.
分 类 号:TP212.2[自动化与计算机技术—检测技术与自动化装置]
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