Cu对Al-Si-Mg-xCu钎料组织及性能的影响研究  

Effect of Cu on microstructure and properties of Al-Si-Mg-xCu solders

作　　者：余静喜 伍玉娇[1,2] 龙琼[2] 罗弦 Yu Jingxi;Wu Yujiao;Long Qiong;Luo Xuan(Department of Materials and Metallurgy Engineering, Guizhou University, Guiyang 550003, China;Guizhou Key Laboratory for Preparation of Light Metal Materials, Guiyang 550003, China)

机构地区：[1]贵州大学材料与冶金工程学院,贵州贵阳550003 [2]贵州理工学院贵州省轻金属材料制备技术重点实验室,贵州贵阳550003

出　　处：《轻金属》2018年第4期48-53,共6页Light Metals

基　　金：贵州省教育厅创新群体项目(黔教合KY字[2016]043);国家自然科学基金(51664009);贵州省科技计划项目(黔科合基础[2016]1067)

摘　　要：试验采用Al-Si-Mg-x Cu系钎料,研究不同Cu含量对钎料组织和性能的影响,并将钎料真空钎焊6061铝合金,对焊接接头的抗拉强度、焊缝形貌和断口特征进行研究。研究结果表明,随着Cu含量的增加,钎料的液相线温度先降低后趋于平稳,而对钎料固相线无显著影响,钎料中脆性相Al2Cu也不断地增多,断口撕裂棱增多;但α-Al固溶体、Al2Cu、Al-Si-Cu和初生Si的形貌和分布基本不变,接头的抗拉强度先增大后减小,当Cu含量为12%时,Cu含量对钎料液相线温度的降低效果达到最大,接头抗拉强度到达最大值94MPa。In this paper the effeet of different Cu eontent on the mierostructure and properties of solders is studied by using Al- Si - Mg - xCu series sold-ers, and the tensile strength of welded joints, the morphology and fracture characteristics of welding seam for vacuum brazing 6061 aluminum alloy is researched. The results show that the liquidus temperature of solder firstly decreases and then tends to be stable with the increase of Cu eontent, while the solid phase of solder has no significant influence. The brittle phase Al2 Cu in the solder is also inereasing and the tearing edge of fracture increases. However, the morphology and distribution of α - Al solid solution, Al2 Cu, Ai - Si - Cu and primary Si are almost unchanged, and the tensile strength of the joint increases first and then decreases. When the content of Cu is 12%, the effeet of Cu eontent on the liquidus temperature of solder reaches the maxi- mum, and the tensile strength reaches the maximum value of 94MPa.

关 键 词：真空钎焊 铜含量 抗拉强度 断口形貌 

分 类 号：TF125.3[冶金工程—粉末冶金]