浅析PCB板面过孔阵列热阻的影响因素  

Analysis of effective factors of Via Thermal Resistance in the Array of the Printed Circuit Board

作　　者：刘镇权 陈冠刚 邬通芳 吴培常 LIU Zhen-quan;CHEN Guan-gang;WU Tong-fang;WU Pei-chang

机构地区：[1]广东成德电子科技股份有限公司,广东佛山528399

出　　处：《印制电路信息》2018年第5期14-18,共5页Printed Circuit Information

摘　　要：印制电路板过孔除了在层与层之间提供电气连通外,还担负起散热作用。文章从过孔密度、过孔直径、过孔铜厚等多方面分析了对热阻的影响性,以便在设计时作选择。In addition to providing electrical connectivity between layers and layers, PCB vias also play a role in heat dissipation. In this paper, the infuence on the thermal resistance is analyzed from the density of the vias, the diameter of the via and the thickness of the copper in via, in order to make choose decision in the design.

关 键 词：散热性能 热阻 过孔阵列 

分 类 号：TN41[电子电信—微电子学与固体电子学]