超厚铜多层PCB板制造工艺研究  

Study on manufacturing process of super thick copper multilayer PCB

作　　者：张强 姚晨 唐琼宁 ZHANG Qiang;YAO Chen;TANG Qiong-nijng

机构地区：[1]中车株洲时代电气股份有限公司,湖南株洲412001

出　　处：《印制电路信息》2018年第5期48-53,共6页Printed Circuit Information

摘　　要：超厚铜多层PCB是具有强弱电连接功能的一体化连接器件。针对0.41 mm以上的超厚铜多层PCB板的制作工艺展开研究,采用单面覆铜板+1.0 mm黑化铜板+环氧板+单面覆铜板进行叠压,层与层之间采用非流动性半固化片进行粘接,有效解决了超厚铜层压白斑、分层等业界难题。The Super thick copper multilayer PCB is an integrated connecting product with strong and weak current connection. The process of making multilayer PCB with thickness greater than 0.41mm is studied. It is laminated by the Copper Clad Laminate, blackened copper and FR4 with bonding between the layers by the minimal resin fow of the prepreg. It efectively solved the technical problem of the laminated spot and stratifcation.

关 键 词：超厚铜多层PCB板 层压技术 内层叠合 

分 类 号：TN41[电子电信—微电子学与固体电子学]