大功耗星载电子设备平面度分析与控制设计  

The flatness analysis and control of spaced-based modular electronic equipment with high power consumption

作　　者：王东[1] WANG Dong(0th Research Institute of China Electronics Technology Group Corporation, Sichuan Chengdu, 610036, China)

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610036

出　　处：《机械设计与制造工程》2018年第5期65-68,共4页Machine Design and Manufacturing Engineering

摘　　要：平面度是星载电子设备热设计过程中需要重点考虑的关键指标。通过分析某大功耗星载模块化电子设备平面度的影响因素,提出了一种星载模块化电子设备满足高平面度要求的设计和过程控制方法。实物测试结果表明,使用该方法可满足设备的平面度指标要求,验证了该方法的正确性和可行性。Flatness is a key index need to realize thermal design of spaced-based electronic equipment. Based on analysis of the factors about the flatness of spaced-based modular electronic equipment with high power consumption,it proposes a design and process control method to meet the requirement of high flatness. The experiment shows that the method satisfies with the actual measuring data,and verifies the correctness and feasibility

关 键 词：大功耗 星载电子设备 平面度 模块化设计 

分 类 号：TG83[金属学及工艺—公差测量技术]