Low bending loss waveguide opens the avenue to downsizing of 3D photonic integrated circuits  

作　　者：YongFeng Lu 

机构地区：[1]Department of Electrical and Computer Engineering, University of Nebraska

出　　处：《Science China(Physics,Mechanics & Astronomy)》2018年第7期103-104,共2页中国科学：物理学、力学、天文学（英文版）

摘　　要：Photonic integrated circuits （PIC） enable efficient and flex- ible control of photons within a compact space, thereby re- volutionizing both information technology and biological and chemical sensing. Currently, semiconductor materials including silicon, silicon nitride （SIN）, and indium phosphate （lnP） are still the prominent PIC platforms, which can be patterned using mature photolithographic technologies [1]. Being an intrinsically planar fabrication technology, increasing the integration density in the photolithography mainly depends on reducing the sizes of individual components.Photonic integrated circuits(PIC)enable efficient and flexible control of photons within a compact space,thereby revolutionizing both information technology and biological and chemical sensing.Currently,semiconductor materials including silicon,silicon nitride(Si N),and indium phosphate(In P)are still the prominent PIC platforms,which can be patterned using mature photolithographic technologies[1].

关 键 词：集成电路 波导 损失 弯曲 3D 信息技术 半导体材料 制造技术 

分 类 号：TN491[电子电信—微电子学与固体电子学]