Thermal and Mechanical Properties of Epoxy Resin Modified with N-(4-hydroxyphenyl)terahydrophthalic Anhydrideimide  

作　　者：徐任信 CHENG Shixin ZHOU Jing SHEN Jie LI Zheng TAN Xing 

机构地区：[1]School of Materials Science & Engineering, Wuhan University of Technology

出　　处：《Journal of Wuhan University of Technology(Materials Science)》2018年第3期744-748,共5页武汉理工大学学报（材料科学英文版）

基　　金：Funded by the National Natural Science Foundation of China(No.51572205);the National Natural Science Foundation of Hubei Province,China(No.2014CFB854);the Equipment Pre-Research Joint Fund of EDD and MOE(No.6141A02033209)

摘　　要：A novel epoxy-imide resin based on diglycidyl ether of bisphenol-A and N-（4-hydroxyphenyl）terahydrophthalic anhydrideimide（HTAM） was synthesized. The structural characterization of the epoxy-imide resin was conducted by FT-IR spectra. 4,4＇-diaminodiphneylmethane（DDM） was used as a curing agent for the epoxy-imide resin. The thermal properties of the cured resin were evaluated with dynamic mechanical analyses（DMA） and thermogravimetric analysis（TGA）. The results showed that the cured resin exhibited a high glass transition temperature（Tg） of 186 ℃ when the molar amount of HTAM was 0.04 mol in the resin. The yields of the cured resin at 800 ℃ raised from 16.45% to 19.41%. The flexural properties were also measured, the flexural strength raised from 79.4 to 95.7 MPa, and the flexural modulus exhibited from 2.6 to 3.0 GPa.A novel epoxy-imide resin based on diglycidyl ether of bisphenol-A and N-（4-hydroxyphenyl）terahydrophthalic anhydrideimide（HTAM） was synthesized. The structural characterization of the epoxy-imide resin was conducted by FT-IR spectra. 4,4＇-diaminodiphneylmethane（DDM） was used as a curing agent for the epoxy-imide resin. The thermal properties of the cured resin were evaluated with dynamic mechanical analyses（DMA） and thermogravimetric analysis（TGA）. The results showed that the cured resin exhibited a high glass transition temperature（Tg） of 186 ℃ when the molar amount of HTAM was 0.04 mol in the resin. The yields of the cured resin at 800 ℃ raised from 16.45% to 19.41%. The flexural properties were also measured, the flexural strength raised from 79.4 to 95.7 MPa, and the flexural modulus exhibited from 2.6 to 3.0 GPa.

关 键 词：epoxy-imide resin glass transition temperature char yield flexural properties 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]