空间补偿算法在高精度贴片设备中的应用  

Application of Space Compensation Algorithm in High Precision Placement Equipment

作　　者：王雁 吕琴红 Wang Yan;LV Oinhong(The Second Research Institute of CETC, Taiyuan 030024, Chin)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2018年第3期171-173,共3页Electronics Process Technology

摘　　要：贴片头的空间补偿算法是保证全自动贴片机能够精确贴片的基础。从如何能够实现高精度贴片的角度出发,研究了影响高精度贴片的关键要素。针对关键要素,重点介绍了贴片头的空间补偿算法。最终通过工艺实验测试,该算法能够满足高精度贴片的要求。The space compensation algorithm is the foundation to ensure the accuracy of the highprecision die bonder during the bonding procedure. The key factors that affect high precision bonding were studied in order to achieve the high quality bonding. Focusing on the key factors, the space compensation algorithm for high precision bonding is introduced. Finally, through the experiment and test, the algorithm can meet the requirements of high-precision bonding.

关 键 词：贴片头 空间补偿算法 高精度贴片 

分 类 号：TN605[电子电信—电路与系统]