电子产品组装中陶瓷电容常见失效模式及改善建议  

Common Failure Modes and Improvement Suggestions for Ceramic Capacitors during Assembling Electronic Product

作　　者：王玉[1] 贾忠中[1] 刘哲[1] WANG Yu;JIA Zhongzhong;LIU Zhe(Zhongxing Telecommunication Equipment Corporation, Shenzhen 518057, China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2018年第3期182-186,共5页Electronics Process Technology

摘　　要：多层陶瓷电容(MLCC)目前已经在电子产品中大量应用。然而,由于陶瓷材料的脆性特点,在电子产品组装的焊接、拼板分板、打螺钉、周转/搬运及功能测试等环节,陶瓷电容容易因热和机械应力而损伤。简要介绍了多层陶瓷电容在电子组装过程中的几种常见失效模式。通过一个案例,对陶瓷电容的机械应力失效模式进行了测试及实验验证,并结合实验数据提出了减少陶瓷电容应力损伤的改善建议。Multilayer ceramic capacitor（MLCC） is widely applied to electronic products, however due to its brittleness, the heat and mechanical stress generated in the assembly process during soldering, plating, screws fixing, turnover/handling, performance test and so on could easily lead to deformation of ceramic capacitor. Briefly discussed several common failure patterns of ceramic capacitor during assembling electronic product. Then through a case study, the mechanical stress failure mode of ceramic capacitors was tested and verified and the improvement suggestion of reducing the ceramic capacitance stress damage was proposed by combining the experimental data.

关 键 词：多层陶瓷电容 开裂 热应力 机械应力 PCB布局 

分 类 号：TN605[电子电信—电路与系统]