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作 者:石金彦[1] SHI JinYan(The 27th Research Institute of CETC,Zhengzhou Henan 45004)
机构地区:[1]中国电子科技集团公司第二十七研究所,河南郑州450047
出 处:《河南科技》2018年第8期18-20,共3页Henan Science and Technology
摘 要:本文根据某室外功放的设计输入,开展了固态功率管的热设计技术研究,提出了风冷散热和水冷散热技术手段,并通过热仿真分析,给出两种散热手段所达到的散热效果,最后,总结了工程设计时要注意的关键点。The technology of thermal design used in solid-state power device was studied, forced air cooling and liquid cooling were introduced for the power amplifier by its design input, the different peak temperature of the solidstate power device was obtained by thermal simulation in this paper, finally, the key points in the process of engineering design were discussed.
分 类 号:TN830.5[电子电信—信息与通信工程]
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