退火工艺对快速凝固Au-20Sn钎料组织与性能的影响  

Effects of Annealing Process on Microstructure and Properties of Rapidly Solidified Au-20Sn Solder

作　　者：刘生发[1] 熊文勇 熊杰然 胡哲兵 陈柱 陈晨 黄尚宇[1] Liu Shengfa;Xiong Wenyong;Xiong Jieran;Hu Zhebing;Chen Zhu;Chen Chert;Huang Shangyu(School of Materials Science and Engineering, Wuhan University of Technology;Shanwei Bolin Electronic Package Material Co., Ltd.)

机构地区：[1]武汉理工大学材料科学与工程学院 [2]汕尾市栢林电子封装材料有限公司

出　　处：《特种铸造及有色合金》2018年第6期608-611,共4页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(51475345)

摘　　要：采用单辊快速凝固技术制备了Au-20Sn钎料薄带,借助FESEM、EPMA和EDS等测试手段,研究退火工艺对快速凝固Au-20Sn钎料合金组织与性能的影响。结果表明,单辊快速凝固Au-20Sn钎料合金由少量树枝状的初生ζ′-Au_5Sn相和共晶组织(ζ′-Au_5Sn+δ-AuSn)组成,显微组织细小。退火过程中,Sn元素从ζ′-Au_5Sn相中向δ-AuSn相中扩散,δ-AuSn相长大。基于钎料薄带显微组织、成分分布和塑性综合考虑,确定退火工艺为240℃×4h。Au-20 Sn solder ribbon was prepared by single-roller rapid solidification technology.The effects of annealing process on microstructure and properties of rapidly solidified Au-20 Sn solder alloy were characterized by FESEM,EPMA and EDS.The results show that the single-roller rapidly solidified Au-20 Sn solder alloy consists of a small amount of primaryζ′-Au5 Sn dendrites and eutectic structure（ζ′-Au5 Sn＋δ-AuSn）,and the microstructure is refined.During the annealing treatment,theδ-AuSn phase grows gradually because Sn element is diffused into theδ-AuSn phase from theζ′-Au5 Sn phase.Based on considering the microstructure,composition distribution and toughness,the annealing process is determined to be at 240 ℃for 4 h.

关 键 词：Au-20Sn钎料 单辊快速凝固 退火 组织性能 

分 类 号：TG156[金属学及工艺—热处理] TG146.31[金属学及工艺—金属学]