光电子封装用柔性并联运动平台的设计与仿真  

Design and simulation of flexible parallel motion platform for photoelectron packaging

作　　者：黄凯[1,2] 高兆康[1,2] 罗定辉 HUANG Kai;GAO Zhao-kang;LUO Ding-hui(State Key Laboratory for High Performance Complex Manufacturing, Central South University, Changsha 410083, China;School of Mechanical and Electrical Engineering , Central South University, Changsha 410083, China)

机构地区：[1]中南大学高性能复杂制造国家重点实验室,湖南长沙410083 [2]中南大学机电工程学院,湖南长沙410083

出　　处：《传感器与微系统》2018年第6期86-88,共3页Transducer and Microsystem Technologies

基　　金：国家自然科学基金资助项目(51575534)

摘　　要：建立了一种用于光电子封装的6自由度刚柔混合的柔性并联运动平台,柔性铰链的加入使整个平台的精度均有所提高。利用ANSYS构建柔性并联机器人中的柔性模块,应用Solid Works建立并联机器人的虚拟样机简化模型,利用ADAMS软件对并联机器人进行了仿真。仿真结果表明:柔性并联平台的位置和旋转精度满足设计要求。A flexible parallel motion platform with 6 degrees of freedom and softness for optoelectronic packaging is proposed. The precision of the whole platform is improved by the addition of flexible hinges. Flexible module in flexible parallel robot is constructed by ANSYS. Solid Works is used to establish virtual prototype simplified model for parallel robot. Parallel robot is simulated by ADAMS software. The position and rotation precision of the flexible parallel platform are obtained by simulation,which is compared with the design requirements. It can be seen that the flexible parallel platform of this structure can meet the requirements.

关 键 词：柔性并联平台 柔性铰链 精度 仿真 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]