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作 者:MING Tingzhen CAI Cunjin YANG Wei SHEN Wenqing FENG Wei ZHOU Nan
机构地区:[1]School of Civil Engineering and Architecture, Wuhan University of Technology, No.122, Luoshi Road, Wuhan430070, China [2]China Energy Group, Environmental Energy Technologies Division, Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, CA 94720 USA [3]Hubei Institute of Aerospace Chemical Technology, Xiangyang 441000, China [4]G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, 30332 USA
出 处:《Journal of Thermal Science》2018年第4期321-330,共10页热科学学报(英文版)
基 金:financially supported by the National Natural Science Foundation of China(Grant No.51778511);the Hubei Provincial Natural Science Foundation of China(Grant No.2018CFA029);the Key Project of ESI Discipline Development of Wuhan University of Technology(WUT Grant No.2017001)
摘 要:The combination of a microchannel heat sink with impinging jets and dimples(MHSIJD) can effectively improve the flow and heat transfer performance on the cooling surface of electronic devices with very high heat fluxes. Based on the previous work by analysing the effect of dimple radius on the overall performance of MHSIJD, the effects of dimple height and arrangement were numerically analysed. The velocity distribution, pressure drop, and thermal performance of MHSIJD under various dimple heights and arrangements were presented. The results showed that: MHSIJD with higher dimples had better overall performance with dimple radius being fixed; creating a mismatch between the impinging hole and dimple can solve the issue caused by the drift phenomenon; the mismatch between the impinging hole and dimple did not exhibit better overall performance than a well-matched design.
关 键 词:microchannel with impinging jets and dimples impinging jet dimple heat transfer enhancement thermal resistance
分 类 号:TK124[动力工程及工程热物理—工程热物理] U674.942[动力工程及工程热物理—热能工程]
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