Simultaneous 2D in-plane deformation measurement using electronic speckle pattern interferometry with double phase modulations  

作　　者：朱云龙 Julien Vaillant Guillaume Montay Manuel Fran?ois Yassine Hadjar Aurélien Bruyant 

机构地区：[1]ICD-L2N, UMR CNRS 6281, Université de Technologie de Troyes [2]ICD-LASMIS, UMR CNRS 6281, Université de Technologie de Troyes

出　　处：《Chinese Optics Letters》2018年第7期40-44,共5页中国光学快报（英文版）

基　　金：financially supported by the ANR Micromorfing Program(ANR-14-CE07-0035);China Scholarship Council(CSC);the Labex Action

摘　　要：Electronic speckle pattern interferometry（ESPI） and digital speckle pattern interferometry are wellestablished non-contact measurement methods. They have been widely used to carry out precise deformation mapping. However, the simultaneous two-dimensional（2D） or three-dimensional（3D） deformation measurements using ESPI with phase shifting usually involve complicated and slow equipment. In this Letter, we solve these issues by proposing a modified ESPI system based on double phase modulations with only one laser and one camera. In-plane normal and shear strains are obtained with good quality. This system can also be developed to measure 3D deformation, and it has the potential to carry out faster measurements with a highspeed camera.Electronic speckle pattern interferometry（ESPI） and digital speckle pattern interferometry are wellestablished non-contact measurement methods. They have been widely used to carry out precise deformation mapping. However, the simultaneous two-dimensional（2D） or three-dimensional（3D） deformation measurements using ESPI with phase shifting usually involve complicated and slow equipment. In this Letter, we solve these issues by proposing a modified ESPI system based on double phase modulations with only one laser and one camera. In-plane normal and shear strains are obtained with good quality. This system can also be developed to measure 3D deformation, and it has the potential to carry out faster measurements with a highspeed camera.

关 键 词：Simultaneous 2D in-plane deformation measurement using electronic speckle pattern interferometry with double phase modulations 

分 类 号：O436.1[机械工程—光学工程]