成形工艺对AuSn20共晶钎料薄带组织与性能的影响  

Effects of Forming Process on Microstructure and Properties of AuSn20 Eutectic Solder Ribbons

作　　者：刘生发[1] 陈柱 刘俐 熊杰然 熊文勇 胡哲兵 陈晨 黄尚宇[1] Liu Shengfa;Chen Zhu;Liu Li;Xiong Jieran;Xiong Wenyong;Hu Zhebing;Chen Chen;Huang Shangyu(School of Materials Science and Engineering,Wuhan University of Technology;Shanwei Bolin Electronic Package Material Co.,Ltd.)

机构地区：[1]武汉理工大学材料科学与工程学院 [2]汕尾市栢林电子封装材料有限公司

出　　处：《特种铸造及有色合金》2018年第7期712-716,共5页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(51475345)

摘　　要：采用普通凝固-轧制工艺和快速凝固-轧制工艺制备了两种AuSn20共晶合金钎料薄带,借助OM、FESEM、XRD、EPMA、EDS、DSC和MTS陶瓷试验系统,比较了其显微组织、物相组成、成分分布、熔化特性和剪切强度。结果表明,相对于普通凝固-轧制工艺,快速凝固-轧制工艺制备的AuSn20共晶合金钎料薄带组织细小、成分均匀,固相线温度和液相线温度分别降低了4.9℃和7.4℃,熔化区间减小2.5℃,润湿性和剪切强度分别提高了10.96%和19.02%。Two kinds of AuSn20 eutectic alloy solder ribbons were prepared by a common casting-rolling process and a rapid solidification-rolling process.The microstructure,phase constitution,composition distribution,melting characteristics and soldering strength of the AuSn20 alloys prepared were analyzed comparatively using optical microscopy,scanning electron microscopy,X-ray diffraction,energy dispersive spectroscopy,differential scanning calorimetry and a MTS ceramic testing system.The results show that the microstructure of AuSn20 eutectic alloy solder ribbons prepared by a rapid solidification-rolling process presents finer and more uniform compared with that of ones by common casting-rolling process.The solidus and liquidus are reduced by 4.9 ℃ and 7.4 ℃,respectively,and the melting range is narrowed by 2.5 ℃.In addition,the wettability and shear strength of the solder joints are increased by10.96% and 19.02%,respectively.

关 键 词：快速凝固 AuSn20钎料 显微组织 性能 

分 类 号：TG146.31[一般工业技术—材料科学与工程] TG113.25[金属学及工艺—金属材料]