键合机芯片翻转机构及其动力学仿真  

Flip-chip Equipment for Bonding and Dynamics Simulation

作　　者：郭耸 朱欢欢 陈飞彪 GUO Song;ZHU Huanhuan;CHEN Feibiao(Shanghai Micro Electronics Equipment Co.,Ltd,Shanghai 201203,China)

机构地区：[1]上海微电子装备有限公司,上海201203

出　　处：《电子工业专用设备》2018年第4期7-9,26,共4页Equipment for Electronic Products Manufacturing

摘　　要：在Fine-Out(扇出)芯片键合制程中需要对芯片(Die)进行重新布局,由于制造工艺的不同,芯片标记面可能存在向上或向下工况。介绍了芯片翻转机构的工作流程和设计开发过程。In the fine-out chip Bonding process, Bonding machine need redistribution for chip.Becauseof different manufacturing process.there are up or down conditions in the chip.this article analyzes thework process and development process for flip-chip Equipment.

关 键 词：扇出片键合 键合机 芯片翻转机构 

分 类 号：TN305[电子电信—物理电子学]