自顶而下的设备软件模块化设计的研究  

Research on Modular Design of Equipment Software Based on Top-down Method

作　　者：崔洁 霍杰 刘子阳 徐品烈 CUI Jie;HUO Jie;LIU Ziyang;XU Pinlie(CETC Beijing Electronic Equipment Co.Ltd.,Beijing 100176,China)

机构地区：[1]北京中电科电子装备有限公司,北京100176

出　　处：《电子工业专用设备》2018年第4期52-54,共3页Equipment for Electronic Products Manufacturing

摘　　要：基于设备系统软件独特的电气硬件平台运行环境,结合软件开发的方法,阐述了设备软件的自顶向下、逐步精细,高内聚低耦合的模块化设计。该设计符合软件工程化思想,是软件设计的基本策略。通过该设计,设备系统可以更好地实现功能要求,满足客户工艺需要。Based on equipment unique electrical hardware platform environment,system software incombination with the methods of software development,this article expounds the top-down,graduallyfine equipment software,high cohesion and low coupling modular design. The design conforms to thesoftware engineering idea,is the basic strategy of software design. Through this design,the equipmentsystem can better realize the functional requirements and meet the customer＇s technological needs.

关 键 词：设备软件 自顶向下 模块化设计 

分 类 号：TN305[电子电信—物理电子学]