绝缘介质层直接导热印制板——高导热化印制板(1)  

Dielectric layer direct thermal conductive PCB–High Thermal Conductive PCB(1)

作　　者：林金堵 LIN Jin-du

出　　处：《印制电路信息》2018年第6期29-34,共6页Printed Circuit Information

摘　　要：文章概述了导热性介质覆铜箔基板的特征,按其导热系数的等级可归纳为五类。通过开发导热绝缘有机聚合物和导热绝缘无机物可以得到导热率为0.2~100 W/m.K或更高的覆铜箔基材。这些导热性介质覆铜箔基材所形成的PCB基本上可以满足各个领域的应用要求。This paper introduces the thermal conductive CCL features. According to the thermal conductivities, CCL could be divided into five types. By development of thermal conductive insulation organic polymer and thermal conductive insulation inorganic materials, CCL with 0.2~100 W/m·K or higher heat conduction could be produced which could meet all fields of application.

关 键 词：导热性介质 导热系数 导热性无机物 导热性聚合物 结构有序化和液晶化 

分 类 号：TN41[电子电信—微电子学与固体电子学]