Electrostatic Actuating Bendable Flat Electrode for Micro Electrochemical Machining  

作　　者：Ruining Huang Xiaokun Zhu 

机构地区：[1]Harbin Institute of Technology(Shenzhen),Shenzhen 518000,China

出　　处：《Nanotechnology and Precision Engineering》2018年第2期133-137,共5页纳米技术与精密工程（英文）

基　　金：supported by the National Natural Science Foundation of China(Grant No.51105110,51475107);Shenzhen Basic Research Program(Grant No.JCYJ20170811160440239)

摘　　要：In micro-electrochemical machining(μECM), material dissolution takes place at very close vicinity of tool electrode due to localization of electric field. Controlling the gap between tool electrode and workpiece is the key to μECM. Therefore, a new method is proposed to solve a variety of problems in small gap control. In the present context, experiments were carried out with an indigenously developed setup to fabricate cylindrical arrays. During the machining process, the flat electrode bends due to electrostatic force in pulse on-time, which self-adaptively narrows the gap between the electrode and the workpiece. The workpiece material will be removed once the gap meets the processing condition. Therefore, this method has advantages of reducing dependence on high precision machine tools and of avoiding complex servo control. The flat electrode quickly restores to its original condition when it is in pulse off-time, making the gap much larger than that in traditional electrochemical machining(ECM). The large gap benefits debris removing, which improves the machining accuracy. The influence of different experimental parameters on accuracy and efficiency during the machining process has been investigated. It is observed that with the increase in applied voltage or concentration of electrolyte, the material removal rate and the process gap both increase. The detailed analysis of the experimental results is described in this paper.In micro-electrochemical machining （μECM）, material dissolution takes place at very close vicinity of tool electrode due to localization of electric feld. Controlling the gap between tool electrode and workpiece is the key to μECM. Terefore, a new method is proposed to solve a variety of problems in small gap control. In the present context, experiments were carried out with an indigenously developed setup to fabricate cylindrical arrays. During the machining process, the flat electrode bends due to electrostatic force in pulse on-time, which self-adaptively narrows the gap between the electrode and the workpiece. Te workpiece material will be removed once the gap meets the processing condition. Terefore, this method has advantages of reducing dependence on high precision machine tools and of avoiding complex servo control. The flat electrode quickly restores to its original condition when it is in pulse of-time, making the gap much larger than that in traditional electrochemical machining （ECM）. The large gap benefits debris removing, which improves the machining accuracy. The influence of different experimental parameters on accuracy and efficiency during the machining process has been investigated. It is observed that with the increase in applied voltage or concentration of electrolyte, the material removal rate and the process gap both increase. Te detailed analysis of the experimental results is described in this paper.

关 键 词：μECM Flat electrode Electrostatic actuation Current density Gap control 

分 类 号：TB4[一般工业技术]