十二烷基苯磺酸钠对铝箔腐蚀扩孔的影响  

Effect of sodium dodecyl benzene sulfonate on extending hole of etched aluminum foil

作　　者：张泽远[1] 吴洪达[1] 蔡小宇 贾佑顺 张兵兵[1] ZHANG Ze-yuan;WU Hong-da;CAI Xiao-yu;JIA You-shun;ZHANG Bing-bing(College of Biological and Chemical Engineering,Guangxi University of Science and Technology,Liuzhou Guangxi 545006,China;Guangxi Hezhou Guidong Electronics Technology Company Limited,Hezhou Guangxi,542899,China)

机构地区：[1]广西科技大学生物与化学工程学院,广西柳州545006 [2]广西贺州市桂东电子科技有限责任公司,广西贺州542899

出　　处：《电源技术》2018年第6期862-864,共3页Chinese Journal of Power Sources

基　　金：广西科学研究与技术开发计划项目(桂科攻1598007-25)

摘　　要：铝箔在HCl-H_2SO_4体系发孔后,在添加有缓蚀剂十二烷基苯磺酸钠的1 mol/L HNO_3溶液中电解扩孔;以730 V二级化成箔的比电容值为主要评价指标,并结合扫描电镜的分析数据,研究了缓蚀剂浓度、扩孔温度和时间对铝箔扩孔效果的影响。结果显示:缓蚀剂的引入提高了化成箔的比电容;缓蚀剂浓度增大时,腐蚀箔的孔密度增大,孔径变小;在730 V下化成时,扩孔液中十二烷基苯磺酸钠的最佳浓度为0.1 g/L,最佳温度为75℃,最佳时间为500 s,阳极箔比电容达到0.481μF/cm^2,比电容提高了20%。With the HCl-H2SO4 as the initial etching solution, sodium dodecyl benzene sulfonate, as the inhibitor, was added into 1 mol/L HNO3 to form the extending hole solution. The effects of the mass concentration of inhibitor,corrosion time, and temperature on the extending hole of etched aluminum foil were investigated according to the SEM analysis data, with the specific capacitance of 730 V secondary formed foils as the main evaluation index. The results show that the introduction of the inhibitor sodium dodecyl benzene sulfonate induce the increasing of the specific capacitance of forming foil. Pit density is increased and pit diameter is decreased with the increase of the concentration of inhibitor. The favorable concentration of sodium dodecyl benzene sulfonate is 0.1 g/L, and when the corrosion time is 500 s at 75 ℃, the maximum specific capacitance of anodic aluminum foils is 0.481 μF/cm2, and increases by 20% comparing with the solution without the inhibitor.

关 键 词：铝阳极箔 十二烷基苯磺酸钠 缓蚀剂 比电容 

分 类 号：TM912[电气工程—电力电子与电力传动]