连接温度对高铌TiAl合金扩散接头组织和强度的影响  

Effect of Bonding Temperature on Microstructure and Strength of High Nb Containing TiAl Alloy Diffusion Joints

作　　者：包潘飞 宋晓国[1,2] 王新波 胡胜鹏 彭赫力 李中权[3] Bao Panfei;Song Xiaoguo;Wang Xinbo;Hu Shengpeng;Peng Heli;Li Zhongquan(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China;Shandong Provincial Key Laboratory of Special Welding Technology,Harbin Institute of Technology at Weihai,Weihai 264209,China;Shanghai Aerospace Precision Machinery Research Institute,Shanghai 201600,China)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,黑龙江哈尔滨150001 [2]哈尔滨工业大学(威海)山东省特种焊接技术重点实验室,山东威海264209 [3]上海航天精密机械研究所,上海201600

出　　处：《稀有金属材料与工程》2018年第7期2132-2136,共5页Rare Metal Materials and Engineering

基　　金：国家科技重大专项(2014ZX04001131);国家自然科学基金(51405099);上海航天科技创新基金(SAST2015045)

摘　　要：在连接工艺参数为1000～1200℃/25MPa/90min条件下,对高铌TiAl合金(TAN)进行直接扩散连接。采用SEM、EDS、XRD和EBSD等方法对连接界面微观组织进行分析,并研究了连接温度对接头界面结构和剪切强度的影响。结果表明:当连接温度T<1100℃时,连接界面清晰垂直,继续升高温度,界面消失;扩散连接过程中,连接界面处出现再结晶现象,随着连接温度的升高,再结晶晶粒不断增多并长大,并且再结晶区域出现大量α_2相;当连接温度达到1150℃时,接头平均抗剪强度达到最大值为105 MPa。The direct diffusion bonding of high Nb containing TiAl alloy（TAN） was conducted at temperatures of 1000～1200 ℃ for 90 min under 25 MPa in vacuum. The effect of bonding temperature on interfacial microstructure and mechanical property of joints was studied and the microstructure of joints was analyzed by SEM, EDS, XRD and EBSD. The results indicate that the distinct interface can be seen when the temperature is below 1100 ℃, and the temperature higher than 1100 ℃ promotes disappearance of the interface;recrystallized grains are observed at bonding interface. The number and size of grains increase with the increase of temperature and a lot ofα2 phases appear in the area of recrystallization; when the connection temperature reaches 1150 ℃, the average shear strength of joints reaches a maximum of 105 MPa.

关 键 词：高铌TIAL合金 扩散连接 微观组织 力学性能 

分 类 号：TG456[金属学及工艺—焊接]