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作 者:王婕丽 詹鑫 孙裴[2] Wang Jieli;Zhan Xin;Sun Pei(Engineering Training Center,Shanghai University of Engineering Science,Shanghai 201620,China;College of Automobile Engineering,Shanghai University of Engineering Science,Shanghai 201620,China)
机构地区:[1]上海工程技术大学工程实训中心,上海201620 [2]上海工程技术大学汽车工程学院,上海201620
出 处:《应用激光》2018年第3期485-495,共11页Applied Laser
基 金:上海市科委地方院校能力建设资助项目(项目编号:17030501400);上海工程技术大学大学生重点科研平台创新训练资助项目(项目编号:cz1605013)
摘 要:针对透明晶体与玻璃等脆硬性材料难加工的特点,总结了目前较为新型的激光加工技术,全面分析归纳各种激光加工工艺特性、理论模型等研究现状;同时,通过对比国内外适用于透明晶体与玻璃中的工业用激光源的特性,展望了激光加工技术在透明晶体与玻璃上的应用发展趋势及方向。In view of the characteristic of difficult processing of brittle and hard materials such as transparent crystal and glass,relative new type of laser processing technology was summarized.The research status of various laser processing properties and theoretical models were comprehensively analyzed and summarized.At the same time,by comparing the characteristics of industrial laser sources used in transparent crystal and glass at home and abroad,the development trend and direction of application of laser processing technology on transparent crystal and glass were prospected.
分 类 号:TN249[电子电信—物理电子学]
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