自然与装配约束条件下PCB组件翘曲影响因素分析  

Analysis of Influence Factor of PCB Component Warpage under Natural and Assembling Constraint

作　　者：郭洪[1] 李伟[1] GUO Hong;LI Wei(The 27th Research Institute of China Electronics Technology Group Corporation,Zhengzhou 450047,Chin)

机构地区：[1]中国电子科技集团公司第二十七研究所,郑州450047

出　　处：《电光系统》2018年第2期61-64,共4页Electronic and Electro-optical Systems

摘　　要：PCB组件在设计和制造过程中采用的多种材料热膨胀系数的差异，容易造成PCB的翘曲，这不仅易造成连接元器件与PCB之间的焊点发生失效，同时也易使芯片内产生张应力而开裂损坏。本文针对PCB结构进行了力学建模，采用有限元分析方法，比较了温度变化及不同约束条件下PCB结构的基板厚度、FR-4材料的弹性模量以及阻焊材料热膨胀系数三种设计参数对PCB翘曲及应力水平的影响，有助于PCB设计参数选择及其翘曲度和应力水平的控制，并对PCB结构设计参数的选择给出合理的建议。During the manufacturing process of PCB, the difference in coefficient of thermal expansion （CTE） of the various materials might very well lead to warpage of the PCB. In this thesis, the finite element method （FEM） is used to compare the effect of three parameters such as thickness of the substrate, modulus of elastic- ity of the FR -d and the thermal expansion coefficient of the solder resist material on PCB warpage and stress level. It could be a benefit to the choice of the design parameters of the PCB and the control of warpage and stress level and several beneficial suggestions are given.

关 键 词：PCB 有限元分析 翘曲 Mises应力 

分 类 号：TN41[电子电信—微电子学与固体电子学]