一种片式T/R组件的热电协同设计方法研究  

Research on Co-Design Method of Electromagnetic and Thermal Field for a Tile Type T/R Module

作　　者：张平[1] 于鹏飞 叶锐[1] ZHANG Ping;YU Pengfei;YE Rui(National Industrial Design Center,No.38 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第三十八研究所国家级工业设计中心,安徽合肥230088

出　　处：《机械与电子》2018年第7期11-14,33,共5页Machinery & Electronics

基　　金：国防科工局基础科研项目(JCKY2016210B002)

摘　　要：针对高密度集成有源相控阵雷达系统中的T/R组件存在显著热-电磁性能耦合的问题。提出一种片式T/R组件的多学科建模及仿真设计方法,通过提取T/R组件的结构和电磁单学科特征进行混合建模,建立用于热-电磁协同分析的多学科数模;对T/R组件多学科数模进行电磁-电路、热-电磁协同分析,获得收发通道的S参数以及实际激励下T/R组件的温度分布;更换芯片在真实温度下的S参数,通过迭代仿真分析直至T/R组件的热、电磁性能全部满足设计要求。该方法具备模型快速修改、不同物理场之间数据匹配传递等优点,可以实现T/R组件的快速、准确全性能设计。In high density integrated active phased array radar system,there are significant thermal-electromagnetic coupling problems for T/R components.This paper proposes a multi-disciplinary modelling and co-simulation method for a new tile type T/R module.First,the module＇s structure and electromagnetic single subject features were extracted to build a multi-disciplinary model for the thermal-electromagnetic collaborative analysis.Then,the collaborative analysis of electromagnetic,circuit,and thermal simulation were performed to obtain some actual data including S parameters of RF channel as well as the active chip temperature under real wave excitation.Next,by adjusting the S-parameter of the chip at the real temperature,iterative simulation analysis was conducted until the thermal and electromagnetic properties of the T/R assembly met all the design requirements.This method has the advantages of rapid model reconstruction and data matching transfer between different physical fields,which can promote the fast,accurate whole performance design of the T/R module.

关 键 词：高集成天线 T/R组件 多物理场耦合 有源芯片 S参数 

分 类 号：TN60[电子电信—电路与系统]