用于PCB协同设计的电子元器件数据模板化研究  

Research on the Data Modularization of the Electronic Components for PCB Collaborative Design

作　　者：陈勇 张鹏南 任艳[2] 戴泽林 CHEN Yong;ZHANG Pengnan;REN Yan;DAI Zelin(Naval Equipment Department Aircraft Office,Beijing 100000,China;CEPREI,Guangzhou 510610,China)

机构地区：[1]海军装备部飞机办公室,北京100000 [2]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2018年第3期41-45,共5页Electronic Product Reliability and Environmental Testing

摘　　要：针对当前电子元器件数据资源难以直接支撑协同设计工作的开展的现状,对用于PCB协同设计的主流仿真软件工具的输入需求进行了梳理。在此基础上,研究了各种软件工具建立数字样机所需的元器件数据,详细地分析论证了各项数据作为实际仿真输入的必要性,形成了协同设计主要工作项目电子元器件数据输入模板,包括信号完整性仿真、热设计和降额设计。研究结果不仅有助于简化仿真流程,提高协同设计效率,同时还为协同仿真数据资源库的建设奠定了基础。In view of the current situation that data resources of electronic components can not directly support the development of collaborative design, the input requirements of mainstream simulation software tools for PCB collaborative design are combed out. On this basis, the component data needed by each software tool to build the digital prototype is studied, and the necessity of the data as the actual simulation input is analyzed and demonstrated in detail, and the electronic component data input templates of the main work items of collaborative design,including signal integrity simulation, thermal design and derating design, are formed. The research results not only help to simplify the simulation process and improve the efficiency of collaborative design, but also lay a foundation for the construction of collaborative simulation data resource library.

关 键 词：协同设计 印制电路极 电子元器件 数据模板化 

分 类 号：TN41[电子电信—微电子学与固体电子学]