航天用表面安装元器件再流焊焊点可靠性分析  

Reliability analysis for SMC by reflow soldering of aerospace electronic products

作　　者：郭晓林[1] 韩彬[1] GUO Xiao-lin,HAN Bin(Tianjin Institute of Power Sources,Tianjin 300384,China)

机构地区：[1]中国电子科技集团公司第十八研究所,天津300384

出　　处：《电源技术》2018年第8期1217-1220,共4页Chinese Journal of Power Sources

摘　　要：通过光学检查、X光检查,金相切片及扫描电镜(SEM)等分析手段,对手工焊接和再流焊接表面安装元器件的焊点结合强度、界面微观组织变化进行研究,依据试验数据对焊接可靠性进行评估,结果表明:按照再流焊接工艺参数焊接的试件,焊接质量可靠,质量一致性优于手工焊接。Aimed at the soldering reliability problem of surface mount component in aerospace electronics, the SMD solder joint structure characteristics, bonding strength and interface microstructure changes after reliability verification were studied, with the process of manual soldering and reflow soldering. The soldering reliability was evaluated with optical inspection, X-ray examination, metallographic section and SEM. The result shows, according to the reflow soldering process parameters, the samples can meet the requirements of the product. The soldering quality was stable, reliable and had a better uniformity than manual soldering.

关 键 词：表面安装元器件 可靠性验证 金属间化合物 

分 类 号：TM91[电气工程—电力电子与电力传动]