电子封装用石墨泡沫/Sn-Bi合金复合材料微观结构和热物理性能（英文）  

Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics

作　　者：连鹏飞[1] 宋金亮[2] 雷世文[1] 陶则超[1] 赵红超[1] 张俊鹏[1] 刘占军[1] LIAN Peng-fei;SONG Jin-liang;LEI Shi-wen;TAO Ze-chao;ZHAO Hong-chao;ZHANG Jun-peng;LIU Zhan-jun(Key Laboratory of Carbon Materials,Institute of Coal Chemistry,Chinese Academy of Sciences,Taiyuan 030001,China;Key Laboratory of Nuclear Radiation and Nuclear Energy Technology,Shanghai Institute of Applied Physics,Chinese Academy of Sciences,Shanghai 201800,China)

机构地区：[1]中国科学院山西煤炭化学研究所炭材料重点实验室,山西太原030001 [2]中国科学院上海应用物理研究所核辐射与核能技术重点实验室,上海201800

出　　处：《新型炭材料》2018年第4期351-356,共6页New Carbon Materials

基　　金：Natural Science Foundation of Shanghai(16ZR1443400);National Natural Science Foundation of China(51602336,21576277,51602335);Youth Innovation Promotion Association CAS(2017205)~~

摘　　要：以中间相沥青为原料,采用加压发泡法制备出不同结构和性能的高导热石墨泡沫。通过Sn-Bi合金高温熔融浸渍石墨泡沫,制备了电子封装用高导热石墨泡沫/Sn-Bi合金复合材料,系统研究了该材料的微观结构和热物理性能。结果表明,Sn-Bi合金均匀分散于石墨泡沫的孔隙结构中;复合材料的密度为3.83±0.01 g/cm^3,其热扩散系数达到163.1±3 mm^2/s,材料的热膨胀系数为8.08±0.02 ppm/K明显低于合金材料的20.7±0.02 ppm/K。通过石墨泡沫基体密度和结构的调控,可制备出低膨胀系数(8.08±0.02,16.4±0.02 ppm/K)的电子封装用高性能石墨泡沫/Sn-Bi合金复合材料。Two mesophase pitch-based graphite foams with densities of 0. 62 ± 0. 01（ GF1） and 0. 84 ± 0. 01 g/cm3（ GF2） were prepared by foaming the pitch in an autoclave at 723 K,6. 0 MPa and 763 K,13. 4 MPa,respectively,followed by carbonization at1273 K for 2 h and graphitization at 2973 K for 0. 5 h. The GFs were infiltrated by a Sn-Bi liquid to prepare GF/Sn-Bi alloy composites for use as thermal sinks for electronics. The microstructures and thermophysical properties of the composites were investigated.Results indicated that GF1 had a larger cells and thinner cell walls than GF2. The Sn-Bi liquid was well infiltrated into cells of the GFs,resulting in composites with densities of 5. 60 ± 0. 01 and 3. 83 ± 0. 01 g/cm3 for GF1 and GF2,respectively. The thermal diffusivity and coefficient of thermal expansion（ CTE） of the GF1/Sn-Bi composite were 51. 6 ± 2 mm2/s and 16. 6 ± 0. 02 ppm/K,respectively. The corresponding values for the GF2/Sn-Bi were 163. 1 ± 3 mm2/s and 8. 08 ± 0. 02 ppm/K. The GF2/Sn-Bi composite had a high thermal diffusivity and a low CTE value matching that of semiconductor chips and packaging materials.

关 键 词：中间相沥青基石墨泡沫 锡铋合金 高热导率 低热膨胀系数 

分 类 号：TQ165[化学工程—高温制品工业]