光电子材料磨粒加工技术综述  

Overview of the Processing Technology of Optoelectronic Abrasive Particles

作　　者：毕佳[1] 郑萌萌[2] BI Jia;ZHENG Mengmeng(Yantai Vocational College,Yantai,Shandong 264000,China;Qufu Normal University,Qufu,Shandong 273165,China)

机构地区：[1]烟台职业学院,烟台264000 [2]曲阜师范大学,曲阜273165

出　　处：《北京印刷学院学报》2018年第3期66-68,共3页Journal of Beijing Institute of Graphic Communication

摘　　要：以石英晶体、单晶硅、钽酸锂、铌酸锂、陶瓷、红蓝宝石等为代表的光电子材料在光电子元件中的应用越来越广泛。本文从线锯切、磨削两个方面详细阐述了光电子材料的磨粒加工技术原理、影响因素及优缺点,并对光电子材料磨粒加工技术发展趋势进行了展望,为下一步研究提出了需要重点关注的领域。The optoelectronic materials represented by quartz crystals, single crystal silicon, lithium niobate, lithium niobate, ceramics, red sapphire and so on are more and more widely used in optoelectronic components. This paper, starting from two aspects of wire sawing and grinding, elaborates the technical principle, influence factors, advantages and disadvantages of optoelectronic abrasive particles processing, and prospects the development tendency of optoelectronic abrasive particles processing technology, which shows the focus area in the future research.

关 键 词：光电子材料 磨粒加工 线锯切 磨削 

分 类 号：TG58[金属学及工艺—金属切削加工及机床]