热冲击下粘-弹塑性材料的热空化  

Cavitation in Visco-Elastoplastic Material Under Thermal Shock

作　　者：吴沛飞 尚新春 WU Pei-fei;SHANG Xin-chun(Department of Applied Mechanics,School of Mathematics and Physics,University of Science and Technology Beijing,Beijing 100083,China;National Center for Materials Service Safety,University of Science and Technology Beijing,Beijing 100083,China)

机构地区：[1]北京科技大学国家材料安全服役科学中心,北京100083 [2]北京科技大学数理学院应用力学系,北京100083

出　　处：《北京理工大学学报》2018年第6期551-556,共6页Transactions of Beijing Institute of Technology

基　　金：国家自然科学基金资助项目(10772024);国家高技术研究发展计划项目(863计划)(2012AA03A513)

摘　　要：理论分析了粘-弹塑性材料的热空化问题.引入对数应变描述塑性区域不可压理想大变形,在粘弹性区采用了小变形理论,由此给出了含单一微孔无限大粘-弹塑性介质中微孔增长问题的数学模型,通过积分方法得到了微孔增长问题的解析解,并推导出了动界面的非线性演化方程.数值算例分析了铝合金材料的热冲击温度、升温率、粘性等因素对于动界面移动规律和微孔动态增长的影响,并且得到了热空化临界温度.The thermal cavitation of visco-elastoplastic material was analyzed theoretically.The mathematical model for void growth in an infinite visco-elastoplastic medium under thermal shock was built,taking into account the ideal incompressible plasticity with big deformation and viscoelasticity with small deformation.The technique of integration was adopted to obtain analytic solutions to void growth.And the nonlinear evolution equation of the moving interface was derived.Numerical examples were presented to analyze the influence of thermal shock temperature,heating rate and viscosity on the moving interface and void growth.Moreover,the critical temperature of thermal cavitation was obtained.

关 键 词：空化 动界面 粘-弹塑性 热冲击 

分 类 号：O345[理学—固体力学] O347[理学—力学]