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作 者:徐幸[1] 罗丹[2] 陈该青[1] 程明生[1] XU Xing;LUO Dan;CHEN Gaiqing;CHENG Mingsheng(The 38th Research Institute of CETC,Hefei 230088,China;Wuhan University of Technology,Wuhan 430070,China)
机构地区:[1]中国电子科技集团公司第三十八研究所,安徽合肥230088 [2]武汉理工大学,湖北武汉430070
出 处:《电子工艺技术》2018年第4期187-190,194,共5页Electronics Process Technology
基 金:国防基础科研项目(项目编号:A1120132016)
摘 要:功能陶瓷的低温连接一直以来都是电子制造领域的难点。采用超声涂覆工艺实现了ZrO_2陶瓷与Sn基焊料的低温连接,并分析了接头的界面连接机理及力学行为。研究结果表明,超声涂覆1 200 s后能在ZrO_2陶瓷表面包覆均匀Sn镀层,并且在Sn/ZrO_2界面形成了ZrSnO_4三元相。ZrSnO_4相的形成与超声空化效应在Sn/ZrO_2界面形成的高温、高压声化学反应环境有关。剪切测试结果表明,ZrO_2/Sn/ZrO_2接头的剪切强度随超声涂覆时间的延长而不断增加,超声涂覆1 200 s时接头的强度达到了32 MPa,剪切失效发生在Sn焊料中。Low-temperature soldering of functional ceramic has always been a challenging issue in the electronic manufacturing area. Low-temperature soldering of ZrO_2 ceramic was realized with an ultrasonic coating method, and the interfacial bonding mechanism and mechanical behavior of joint was investigated. Results showed that a Sn metallization layer was coated on the ZrO_2 surface, and a ZrSnO_4 ternary phase was formed at the Sn/ZrO_2 interface. The formation of ZrSnO_4 phase was associated with the acoustic cavitations induced high temperature and pressure at the Sn/ZrO_2 interface. Shearing test results showed that the shear strength of ZrO_2/Sn/ZrO_2 joint was improved with increasing ultrasonic coating time. The strength joint coated for 1 200 s reached to 32 MPa, and the shearing failure occurred in the Sn solder layer.
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