钛合金喷管TLP扩散连接的数值模拟研究  

Numerical Simulation of TLP Diffusion Bonding of Titanium Alloy Nozzle

作　　者：赵鼎 毛根旺[1] 宋国新 ZHAO Ding;MAO Genwang;SONG Guoxin(School of Aerospace,Northwestern Polytechnical University,Xi＇an 710072,China;Xi＇an Space Engine Factory,Xi＇an 710100,China)

机构地区：[1]西北工业大学航天学院,陕西西安710072 [2]西安航天发动机厂,陕西西安710100

出　　处：《热加工工艺》2018年第15期210-213,共4页Hot Working Technology

摘　　要：利用Dictra动力学软件中的界面移动模型对中间层Cu元素在TC4钛合金TLP扩散连接界面附近的浓度分布规律进行了模拟研究,获得了中间层厚度、连接温度和保温时间对Cu元素扩散距离的影响趋势。结合喷管模拟件的焊接试验,验证了扩散模拟计算的正确性。计算结果表明,中间层厚度不宜超过20μm;连接温度对中间层Cu元素的扩散距离影响最大,其次为保温时间,中间层厚度对扩散距离无显著影响。对于钛合金喷管模拟件,接头强度最优的工艺参数组合为连接温度970℃,保温时间50 min,中间层厚度为20μm。The concentration distribution law of the interlayer Cu element at the TLP diffusion bonding interface of TC4 titanium alloy was simulated by using the interface moving model in Dictra dynamic software. The influence of the interlayer thickness, bonding temperature and holding time on the diffusion distance of Cu element was obtained. The experimental welding of the nozzle simulator verified the correctness of the diffusion simulation. The results show that the interlayer thickness should not exceed 20 μm, and the bonding temperature has the greatest influence on the diffusion distance of the interlayer Cu element, followed by the holding time and the interlayer thickness has no significant effect on the diffusion distance. For the titanium alloy nozzle simulator, the optimum process parameters for joint strength are bonding temperature of940℃, holding time of 50 min, the interlayer thickness of 20 μm.

关 键 词：钛合金喷管 TLP扩散连接 工艺参数 数值模拟 

分 类 号：TG456.9[金属学及工艺—焊接]