摄像头模组粘接用UV/热双固化胶粘剂的研制  

Preparation of UV/Heat Dual Curing Adhesive for Camera Module Bonding

作　　者：李会录[1] 霍翠 祁向花 王刚 LI Huilu;HUO Cui;QI Xianghua;WANG Gang(College of Materials Science and Engineering,Xi＇an University of Science and Technology,Xi＇an 710054,China)

机构地区：[1]西安科技大学材料科学与工程学院,陕西西安710054

出　　处：《绝缘材料》2018年第8期6-11,共6页Insulating Materials

基　　金：国家自然科学基金资助项目(21204072)

摘　　要：以脂环族环氧树脂(2021P)、改性脂环族环氧树脂(PB3600)为基体树脂,并加入阳离子光引发剂、潜伏型热固化剂、填料等混合配制胶液,制备了用于摄像头模组粘接的UV/热双固化胶粘剂。通过调节不同配比,研究UV固化速率、热固化温度和时间的影响因素。结果表明:摄像头模组粘接胶的最佳配方为m(2021P)∶m(PB3600)∶m(Irgacure261)∶m(改性三氟化硼单乙胺)=100∶20∶4∶5,此时摄像头模组粘接胶粘剂具有高粘接强度、高储能模量、高T_g、低收缩率及优异的耐热性能等。Using acrylic epoxy resin（2021 P） and modified acrylic epoxy resin（PB3600） as matrix resin,a UV/heat dual curing adhesive for camera module bonding was prepared by blending with cationic photo initiator, latent heat curing agent, and fillers. The effects of mixture ratios on the UV curing rate, heat curing temperature and time were studied. The results show that the best formula of camera module adhesive is m（2021 p）∶m（PB3600）∶m（Irgacure261）∶m（modified boron trifluoride ethylamine） =100∶20∶4∶5, and the adhesive has high bonding strength, high storage modulus, high T_g, low shrinkage, and excellent heat resistance.

关 键 词：UV/热双固化 收缩率 粘接强度 耐热性能 

分 类 号：TM215.43[一般工业技术—材料科学与工程]