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作 者:兀松 曾大文[1] 李文飞 谢长生[1] WU Song;ZENG Da-wen;LI Wen-fei;XIE Chang-sheng(Department of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China)
机构地区:[1]华中科技大学材料科学与工程学院,湖北武汉430074
出 处:《材料保护》2018年第8期80-85,共6页Materials Protection
基 金:国家自然科学基金(50927201)资助
摘 要:银颗粒膜因具有十分优异的性能而被广泛用作抗菌材料、包装材料、导电和反射薄膜、功能织物等。然而,目前使用化学镀的方法在聚乙烯基体上制备银颗粒膜以及化学镀银的沉积动力学的相关研究比较少。为此,采用化学镀工艺在聚乙烯基体上制备了银颗粒薄膜,详细介绍了聚乙烯基银颗粒膜的制备方法以及沉积动力学,研究了银离子浓度、酒石酸根离子浓度和反应温度对沉积动力学的影响。结果表明,银的沉积过程包括孕育期、加速期和减速期这3个阶段,与"半球面自催化动力学模型"吻合。通过计算得到了化学镀银反应的简化速率方程和表观活化能。Silver particle films have potential application as antibacterial materials, packing materials, conductive and reflective films due to their excellent properties. However, few studies were done to investigate the preparation of the silver particle film on polyethylene and the deposition kinetics by electroless plating. In this paper, silver particle films were deposited on polyethylene by electroless plating. The preparation method and silver deposition kinetics were explained in detail. Besides, the influences of the concentrations of silver ions and tartrate ions as well as the reaction temperature on kinetics were investigated. Results indicated that the silver deposition process included three stages: incubation, acceleration and deceleration, which was in good agreement with the kinetic model of "hemispherical autocatalytic deposition". By calculation, the simplified rate equation and apparent activation energy of the reaction were obtained.
分 类 号:TQ153.1[化学工程—电化学工业]
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