真空退火对热蒸发纳米Cu薄膜性能的影响  

Influence of Vacuum Annealing on Properties of Nano-Copper Thin Film by Thermal Evaporation

作　　者：张明朝 汪林文 李玲[1,1] 陈艳[1] 张祥 蔡金阳 陈卫东[1] ZHANG Ming-chao;WANG Lin-wen;LI Ling;CHEN Yan;ZHANG Xiang;CAI Jin-yang;CHEN Wei-dong(School of Physics ＆ Electronic Engineering,Sichuan Normal University,Chengdu 610101,China)

机构地区：[1]四川师范大学物理与电子工程学院,四川成都610101

出　　处：《材料保护》2018年第8期86-89,共4页Materials Protection

基　　金：四川师范大学第十二批学生科研创新项目(201710636379);四川省教育厅重点项目(16ZA0047)资助

摘　　要：退火是提高薄膜材料耐温性及导电性的重要手段。采用热蒸发法在载玻片上沉积厚约132 nm的Cu薄膜,再分别在100,200,300,400,500℃对薄膜进行退火处理,得到不同温度退火的纳米Cu薄膜;用原子力显微镜、四探针电阻测试仪和X射线衍射仪研究了退火温度对纳米Cu薄膜表面形貌、导电性能和晶体结构的影响。结果表明:当退火温度在500℃以下时,纳米Cu薄膜表面粗糙度和颗粒直径随着温度升高而增大,当温度到达500℃时突然减小; Cu薄膜的方块电阻随退火温度的升高呈降低趋势,薄膜的变异系数则出现先减小后增大的现象,当温度为300℃时变异系数最小;随着退火温度的升高,Cu薄膜的Cu(111)和Cu(200)晶面衍射峰越来越明显。In this paper, all the copper （Cu） thin films with the fixed thickness of 132 nm were fabricated on glass substrate using thermal evaporation method, then annealed at 100, 200, 300,400, 500 ℃ , respectively. The effects of the annealing temperature on the surfhcc mor- phology, conductivity and crystal structure of Cu thin films were successively investigated by AFM （atomic force microscopy） , the four-probe method （RTS-9, four probe technology） and XRD（ X-ray diffractometer）. Results indicated that the root-mean-square （RMS） surface rough- ness and nano-particles （NPs） diameter of Cu thin films increased with the increase of the annealing temperature when the annealing tempera- ture was below 500 ℃, while at 500 ℃ the RMS and NPs diameter of Cu thin films abruptly decreased. Besides, the sheet resistance of Cu thin films had a decreased trend with the increase of the annealing temperature. However, the variation coefficient of Cu thin films decreased first and then increased, and at 300 ℃ the variation coefficient had a minimum value. In addition, the crystal diffraction peaks of Cu （ 111 ） and Cu （200） became more and more obviously with the increase of the annealing temperature.

关 键 词：纳米Cu薄膜 热蒸发法 导电性能 表面形貌 晶体结构 

分 类 号：TG156[金属学及工艺—热处理]