市场返回单板高压采样电路失效分析  

Failure Analysis of High Voltage Sampling Circuit for Market Returned PCBA

作　　者：高正利 王龙 徐元龙 GAO Zhengli;WANG Long;XU Yuanlong(TBEA Xi＇an Electric Technology Co.,Ltd.,Xi＇an 710000,China)

机构地区：[1]特变电工西安电气科技有限公司,西安710000

出　　处：《电工技术》2018年第16期147-149,共3页Electric Engineering

摘　　要：本文介绍某项目市场返回单板的失效定位分析过程,并从工程防护、单板加工、器件选型设计等各方面提出有针对性的优化整改措施,以提高整体系统的环境适应性。The location process of failure of a project market returned PCBA was analyzed.From the aspects of engineering protection,PCBA,components selection and design etc.,the optimization measures were proposed to improve the environmental adaptability of the system.

关 键 词：高压采样电路 矩形贴片薄膜电阻 

分 类 号：TM544[电气工程—电器]