Au纳米粒子修饰金电极测定痕量铜  

Determination of Trace Copper By Au Nanoparticles Modified Gold Electrode

作　　者：文莉 古昌红 WEN Li;GU Chang-hong(Chongqing Technology and Business University,College of Environment and Resources,Chongqing 400067,China)

机构地区：[1]重庆工商大学环境与资源学院,重庆400067

出　　处：《重庆工商大学学报（自然科学版）》2018年第5期113-116,共4页Journal of Chongqing Technology and Business University:Natural Science Edition

基　　金：重庆市教委科技项目(KJ130718);重庆工商大学博士科研启动项目(2010-56-08)

摘　　要：采用方波溶出伏安法,以自组装单层保护Au纳米粒子修饰金电极为工作电极测定铜离子;实验结果表明:在0.2 mol/L的NaCl体系下,富集电位为-0.25 V,Au纳米粒子修饰金电极测得铜的峰电流值为9.746×10^(-8)A,裸金电极的峰电流值为2.335×10^(-8)A;经过修饰后的金电极峰电流明显大于裸金电极的峰电流,且随Au纳米粒子组装时间增加,修饰后的金电极测出的峰电流也明显增大。A method for determination of copper by linear sweep anodic stripping voltammetry using self-assembled monolayers of Au clusters /nanoparticles on a gold electrode surface is reported in this paper. It has been shown that in a 0.2mol/L NaCL , the enrichment potential is -0.25V, and the peak current determined by the Au nanoparticles modified gold electrode is 9.746×10^ -8 A, and the peak current determined by the bare gold electrode is 2.335×10 ^-8 A.The peak current of the modified gold electrode is obviously larger than the peak current of the bare gold electrode. The peak current measured by the modified gold electrode increases with the increase of the assembling time of the Au nanoparticles.

关 键 词：AU纳米粒子 自组装 阳极溶出伏安法 铜测定 

分 类 号：O647.1[理学—物理化学]