Effects of Surfactants SDS and CTAB on Ni-SiC Deposition  

作　　者：阚洪敏 FENG Xiaojun WEI Xiaodong ZHANG Ning WANG Xiaoyang LONG Haibo 

机构地区：[1]Key Laboratory of Advanced Materials Technology of Liaoning Province,Shenyang University,Shenyang 110044,China

出　　处：《Journal of Wuhan University of Technology(Materials Science)》2018年第4期836-842,共7页武汉理工大学学报（材料科学英文版）

基　　金：the Program for Liaoning Excellent Talents in University(LJQ2015074);the Shenyang Science and Technology Plan(17-231-1-15)

摘　　要：The influences of surfactant type and concentration on the content and uniformity of SiC particles in Ni-SiC deposit were studied in this paper. The electrochemical behavior of preparing Ni-SiC composite coating was investigated using the cyclic voltammetry method. Then the impact of surfactants on the deposition potential of Ni-SiC coating was analyzed. Electrochemical studies showed that the cathode overvoltage increases gradually with increasing SDS（Sodium dodecyl sulfate） concentration. The CV curve showed the shift towards a lower current at a given potential with increasing SDS concentration. Ni-SiC composite coatings were prepared by electrodeposition. The experimental results show that the dispersion of 40 nm SiC in Ni-SiC coating obtained in the electrolyte containing SDS is superior that containing CTAB（cetyltrimethyl ammonium bromide）. CTAB increases the content of 40 nm SiC particles in the Ni-SiC coating, but the uniformity of 40 nm SiC particles in Ni-SiC composite coating is poor. SiC particles are still agglomerated. Compared with the anionic surfactant SDS and the cationic surfactant CTAB, surfactant SDS makes the particles better dispersed. But the contribution of surfactant SDS for co-deposition amount of SiC particles is negligible. The cationic surfactant CTAB can effectively improve the suspension performance of SiC particles and promote the co-deposition of SiC particles and metallic nickel. But there is still some reunion of SiC.The influences of surfactant type and concentration on the content and uniformity of SiC particles in Ni-SiC deposit were studied in this paper. The electrochemical behavior of preparing Ni-SiC composite coating was investigated using the cyclic voltammetry method. Then the impact of surfactants on the deposition potential of Ni-SiC coating was analyzed. Electrochemical studies showed that the cathode overvoltage increases gradually with increasing SDS（Sodium dodecyl sulfate） concentration. The CV curve showed the shift towards a lower current at a given potential with increasing SDS concentration. Ni-SiC composite coatings were prepared by electrodeposition. The experimental results show that the dispersion of 40 nm SiC in Ni-SiC coating obtained in the electrolyte containing SDS is superior that containing CTAB（cetyltrimethyl ammonium bromide）. CTAB increases the content of 40 nm SiC particles in the Ni-SiC coating, but the uniformity of 40 nm SiC particles in Ni-SiC composite coating is poor. SiC particles are still agglomerated. Compared with the anionic surfactant SDS and the cationic surfactant CTAB, surfactant SDS makes the particles better dispersed. But the contribution of surfactant SDS for co-deposition amount of SiC particles is negligible. The cationic surfactant CTAB can effectively improve the suspension performance of SiC particles and promote the co-deposition of SiC particles and metallic nickel. But there is still some reunion of SiC.

关 键 词：NI-SIC Nano composite coating SURFACTANTS UNIFORMITY content 

分 类 号：TQ153[化学工程—电化学工业]