N+N双面盲压背板盲孔污染问题研究  

Research on the Blind Via Pollution Problem of N+N Double-sided Blind Pressfit Backplane

作　　者：王小平 杜红兵 任尧儒 袁继旺 纪成光 Wang Xiaoping;Du Hongbing;Ren Yaoru;Yuan Jiwang;Ji Chengguang

机构地区：[1]生益电子股份有限公司,广东东莞523039

出　　处：《印制电路信息》2018年第9期52-57,共6页Printed Circuit Information

摘　　要：盲孔压接区的污染问题是N+N双面盲压背板制作过程中最常见的问题。本文建立鱼骨图对盲孔压接区的破损污染问题进行了分析,找到了产生盲孔区污染的主要原因为:半固化片开槽设计、钻孔后烘板、去毛刺铜皮破损、阻焊前烘板、各工序擦花及成品酸洗,通过优化设计、工艺和制程管控来解决成品开盖前的盲孔污染问题。The blind via area pollution is the most common problem during the N＋N double-sided blind pressfit backplane manufacturing process. Fishbone diagram was constructed to analyze the blind via area pollution problem. On this basis, the root causes of blind via area pollution were founded： Prepreg slotting, baking after drilling, copper foil damage after deburring, Tack dry of solder mask, the process abrasion and finished pickling. The blind via area pollution problems before finished pickling were solved by the design optimization and the quality control in process.

关 键 词：背板 N+N结构 盲孔区 发黑 

分 类 号：TN41[电子电信—微电子学与固体电子学]