液态金属高性能冷却技术:发展历程与研究前沿  

Advanced liquid metal cooling: Historical developments and research frontiers

作　　者：杨小虎[1,2] 刘静 YANG Xiaohu;LIU Jing(Key Lab of Cryogenics,Technical Institute of Physics and Chemistry,Chinese Academy of Sciences,Beijing I00190,China;School of Future Teehnology,University of Chinese Academy of Seiences,Beijing 100049,China;Department of Biomedical Engineering,Tsinghua University,Beijing 100084,China)

机构地区：[1]中国科学院理化技术研究所、中国科学院低温工程学重点实验室,北京100190 [2]中国科学院大学未来技术学院,北京100049 [3]清华大学生物医学工程系,北京100084

出　　处：《科技导报》2018年第15期54-66,共13页Science & Technology Review

基　　金：中国科学院院长基金项目;中国科学院前沿科学重点研究计划项目;国家自然科学基金重点项目(91748206)

摘　　要：＂热障＂问题已经成为阻碍高端电子芯片和光电器件向更高性能发展的重要挑战,发展高性能芯片冷却和热管理技术迫在眉睫。作为一大类新兴的热管理材料,液态金属在对流冷却、热界面材料、相变热控等领域均带来了观念和技术上的巨大革新,打破了传统冷却技术的性能极限,给大量面临＂热障＂难题的器件和装备的冷却提供了全新解决方案,有望在国防、航空航天、能源系统及民用电子设备等领域的冷却与热管理系统中发挥重要作用。本文回顾了液态金属先进冷却技术的发展历程,主要包括液态金属对流冷却技术、液态金属热界面材料、液态金属（低熔点金属）相变储能与热控技术、基于液态金属的复合冷却技术等;梳理了液态金属冷却技术中的关键科学与技术问题和面临的挑战。The thermal barrier problem has been a major bottleneck that hinders the development of high-profile chips and optoelectronic devices. Hence, it is urgent to develop high-performance chip cooling and thermal management technologies to tackle this challenge. As a class of newly emerging thermal management materials, liquid metals have revolutionized the concepts and technologies in the areas of convective cooling, thermal interface materials, and phase change materials. The liquid metals enable cooling technologies to break the performance limit of conventional cooling methods and provide powerful solutions for the cooling of devices and equipment which are faced with tough thermal barrier issues. They are expected to play a key role in areas such as defense equipment, aerospace industry, energy systems, and consumer electronics. This paper is dedicated to a systematic review on the developments and frontiers of liquid metal cooling technologies, mainly including liquid metal convection cooling, liquid metal based thermal interface materials, low melting point metal phase change materials and liquid metal enabled combinatorial heat transfer science and cooling technologies. The main scientific issues and technical challenges lying behind are outlined and discussed in order to help better stimulate the development and applications in the area.

关 键 词：液态金属 芯片冷却 高热流密度 双流体 热界面材料 相变材料 组合传热学 

分 类 号：TG111.4[金属学及工艺—物理冶金]