醇类物质对LED硅胶封装气密性的影响  

Effect of Alcohol on Air Tightness of LED Silicone Encapsulation

作　　者：文尚胜[1] 彭星 马丙戌 宋嘉良 符民 方方 胡捷频 康丽娟[4] 孔令豹 WEN Shang-sheng;PENG Xing;MA Bing-xu;SONG Jia-liangl;FU Min;FANG Fang;HU Jie-pin;KANG Li-juan;KONG Ling-bao(State Key Laboratory of Luminescent Materials and Devices,South China University of Technology,Guangzhou 510640,China;Shanghai Engineering Research Center of Ultra-Precision Optical Manufacturing,School of Information Science and Technology,Fudan University,Shanghai 200433,China;Gold Metal Analytical＆Testing Group,Guangzhou 511300,China;Academy of Fine Arts Souths China Normal University,Guangzhou 510631,China)

机构地区：[1]华南理工大学发光材料与器件国家重点实验室,广州510640 [2]复旦大学信息科学与工程学院上海超精密光学制造工程技术研究中心,上海200433 [3]广东金鉴检测科技有限公司,广州511300 [4]华南师范大学美术学院,广州510631

出　　处：《光子学报》2018年第8期127-132,共6页Acta Photonica Sinica

基　　金：广东省科技计划项目(Nos.2017B010114001;201704030140;2015B010127004);广东省应用型科技研发专项(No.2015B010134001);广州市科技计划项目(Nos.201604040004;201604016010);广东省扬帆计划(No.2015YT02C093);中山市科技计划项目(Nos.2016A1009;2017C1011)资助~~

摘　　要：为了探究发光二极管(LED)封装胶对LED失效性的影响,选取LED封装硅胶失效案例进行了失效性分析.利用傅里叶转换红外光谱分析和气相色谱质谱联用仪对失效样品进行成分分析,根据分析结果总结样品的失效机理.分析结果表明:LED灯珠封装气密性检测过程中材料的化学不兼容性导致封装胶失效,LED灯珠气密性变差,进而影响到光、电、热、机械结构、材料特性等,LED可靠性降低.在LED生产制造过程中,需要避免材料的不兼容性,增加LED的可靠性.In order to explore the impact of Light Emitting Diode （LED） silicone package on the LED failure, the failure case of LED packaging glue is chosed to analyze the failure. Fourier transform infrared spectroscopy and gas chromatography mass spectrometry were used to analyze the composition of the failed samples. Finally, the failure mechanism of the samples was obtained based on the analysis results. The analysis results show that, the chemical incompatibility of the material in the LED lamp bead package sealing process leads to the failure of the sealing glue, and the LED lamp beads have a poor air tightness, which affects the light, electricity, heat, mechanical structure, and material properties. LED reliability is reduced; therefore, in the manufacturing process of LED, it is also necessary to avoid material incompatibility and increase the reliability of the LED.

关 键 词：LED 封装硅胶 可靠性 失效 不兼容性 气密性 

分 类 号：TN383.1[电子电信—物理电子学]