星载微波固态大功率组件预防微放电效应工艺研究  

The Technics to Restrain Multipactor Effect in Satellite-borne Solid-state High Power Microwave Assembly

作　　者：刘炜[1] 王仁军 陈梁 洪希依 庄绪德 褚士震 LIU Wei;WANG Renjun;CHEN Liang;HONG Xiyi;ZHUANG Xude;CHU Shizhen(Nanjing Electronic Devices Institute,Nanjing,210016,CHN)

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《固体电子学研究与进展》2018年第4期287-291,共5页Research & Progress of SSE

摘　　要：设计了一种微波信号输出端转换结构,可以达到在300 W以下功率工作时不发生微放电效应,并且工作频率在X波段时微波信号传输损耗低于0.4dB。讨论了密封工艺、拼板结构、表面处理工艺等工艺方法。这些工艺方法通过降低局部电场强度及材料表面二次电子发射系数以预防微放电效应。将这些工艺方法应用在一款输出功率120W的X波段星载微波固态大功率组件中,经试验结果表明,该组件在热真空条件下未发生微放电效应。An output terminal conversion structure was designed.When it operates in X band,the multipactor effect does not occur when the power is less than 300 Wand the microwave signal insert loss is less than 0.4 dB.The sealing process,board staggered structure and surface treatment technic were discussed.The technics restrain multipactor by reducing local electric field intensity and secondary electron emission coefficient on the surface of materia.These technics have been used in the X band satellite-borne solid-state microwave high power assembly with output power of 120 W.The experiment results show that the assembly has no multipactor effect under thermal vacuum condition.

关 键 词：星载设备 微波 功率放大器 微放电 工艺 

分 类 号：TN74[电子电信—电路与系统]