IGBT热网络传热模型研究  

Thermal Network Model for IGBT Power Modules

作　　者：陈明 曾书俐 Chen Ming;Zeng Shuli(Naval Representatives Office in Guangzhou No.427 Company,Guangzhou 510715,China;C SSC Huangpu Wenchong Ship Building Co.,Ltd.,Guangzhou 510715,China)

机构地区：[1]海军驻广州四二七厂军事代表室,广州510715 [2]中船黄埔文冲船舶有限公司,广州510715

出　　处：《船电技术》2018年第9期1-6,10,共7页Marine Electric & Electronic Engineering

基　　金：国家自然科学基金重点项目(50737004)

摘　　要：在加入层间接触热阻的7层Cauer热网络模型基础上,考虑了材料导热系数随温度变化的函数关系,在芯片结构和实验测试结果基础上加入了结表热阻以及各物理层间的扩散热阻,建立了一种改进的多维IGBT热网络传热模型。采用所建模型对模块各物理层温度特性,特别是结温特性进行了仿真计算,并和实际探测结果进行比对分析。分析结果表明改进的热网络模型较传统热网络传热模型具有更高的精度。With the lumped parameter method, a 7-layer RC compact thermal network model is established. An improved RC compact thermal component network model is also constructed, who se accuracy rises, because the model includes the contact thermal resistance between layers and the variation of thermal conductivity of materials and junction-surface thermal resistance and dissipation thermal resistance and dissipation thermal resistance. The junction-surface thermal resistance is calculated by differentiating the inner junction temperature and surface temperature of the chip. The improved model can predict the undetectable temperature and temperature distribution of each layer.

关 键 词：绝缘栅双极型晶体管 热网络 传热模型 

分 类 号：TN341[电子电信—物理电子学]