半导体行业镀膜用高纯银的制备方法及展望  

The Preparation Method and Expectation of High Purity Silver for Coating of Semiconductor Industry

作　　者：张济祥 冯俊花 朱勇 阳岸恒 邓志明 吴庆伟 ZHANG Ji-xiang;FENG Jun-hua;ZHU Yong;YANG An-heng;DENG Zhi-ming;WU Qing-wei(Yuxi Normal University,Yuxi,Yunnan 653100,China;State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-platinum Metals Co.,Ltd.,Kunming,Yunnan 650106,China)

机构地区：[1]玉溪师范学院,云南玉溪653100 [2]贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,云南昆明650106

出　　处：《云南冶金》2018年第5期55-58,共4页Yunnan Metallurgy

基　　金：国家科技支撑计划项目(2012BAE06B05)

摘　　要：高纯银广泛应用于半导体领域,通过制成靶材或蒸发源材料,采用溅射或蒸镀工艺沉积于基体表面。银的纯度对镀膜的质量影响非常大,随着半导体集成电路领域的飞速发展,对镀膜中所使用的高纯银材料纯度提出了更高的要求,必须达到99. 999%以上。介绍了高纯银的制备方法,综述了国内外高纯银制备的研究现状,分析了存在的问题,并提出了今后高纯银制备的研究方向。High purity silver widely used in semiconductor field,which can deposit on the substrate surface by sputtering or evaporation process by making as the target material or evaporation source material. The purity of silver has a great influence on the quality ofcoating,with the rapid development of the field of semiconductor integrated circuits field,the purity of silver is requested to reach more than99 999%. This paper introduces the preparation methods of high purity silver at home and abroad,analyzes the existing problems,and putsforward the future research direction.

关 键 词：高纯银 制备 湿法提纯 电解法 

分 类 号：O614.122[理学—无机化学]