低介电常数和低介电损耗的含二硅氧烷共聚聚酰亚胺的制备研究  被引量:9

Preparation of Disiloxane-containing Copolyimide with Low Dielectric Constant and Low Dielectric Loss

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作  者:王铭钧[1] 杨晓慧[1] 姚洪喜[1] 鲍忠桢 WANG Mingjun, YANG Xiaohui, YAO Hongxi, BAO Zhongzhen(School of Chemistry and Chemical Engineering, Shanghai ,liao Tong University, Shanghai 200240, China)

机构地区:[1]上海交通大学化学化工学院,上海200240

出  处:《绝缘材料》2018年第10期16-21,共6页Insulating Materials

摘  要:将四甲基-双(r-氨丙基)-二甲基硅氧烷(APDS)和4,4′-二氨基二苯醚(ODA)混合,然后分别与均苯四甲酸酐(PMDA)、3,3′,4,4′-二苯酮四甲酸酐(BTDA)和3,3′,4,4′-二苯醚四甲酸酐(ODPA)进行无规共聚,合成了3种含二甲基硅氧烷的共聚聚酰亚胺(POA、BOA和ODOA)。采用热重分析(TGA)和差示扫描量热法(DSC)对其热性能进行了表征,用介电分析仪对3种共聚聚酰亚胺在频率为0.1~105Hz和温度为50~300℃的介电常数和介质损耗因数(tanδ)进行了测试。结果表明:在频率≥103Hz和温度为50~250℃时,3种聚酰亚胺的介电常数均为2.2~2.4,变化很小。在频率≤103Hz时,温度对介电常数的影响明显增大,特别是温度高于200℃时影响显著。在一定频率下,tanδ随温度的升高而逐渐增大,在高频时tanδ增加很慢。在一定温度下,tanδ随频率的升高而减小。Tetramethyl-bis-(r-aminopropyl)-dimethylsiloxane(APDS) was mixed with 4,4′-diaminodiphenyl ether(ODA), then the mixture was reacted with pyromellitic dianhydride(PMDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride(BTDA), and 4,4′-oxydiphthalic anhydride(ODPA), respectively, and three different kinds of copolyimide containing disiloxane(POA, BOA and ODOA) were synthesized by random copolymerization. The thermal performance of the copolyimides were characterized by thermogravimetric analyzer(TGA) and differential scanning calorimeter(DSC), and the dielectric constant and dielectric loss factor of the copolyimides were tested by dielectric analyzer under the frequency ranging from 0.1 Hz to105 Hz and the temperature ranging from 50 ℃ to 300 ℃. The results show that when the frequency is no less than 103 Hz and the temperature ranges from 50 ℃ to 250 ℃, the dielectric constant of the copolyimides is 2.2~2.4. When the frequency is no more than 103 Hz, the effect of temperature on the dielectric constant increases obviously, and the effect is remarkable when the temperature is higher than200 ℃. Under certain frequency, the dielectric loss factor increases gradually with the increase of temperature but increases very slow under high frequency. Under certain temperature, the dielectric loss factor decreases with the increase of frequency.

关 键 词:低介电常数 低介质损耗 频率 温度 含硅氧烷共聚聚酰亚胺 介电分析方法 

分 类 号:TM215[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]

 

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