机载智能化网络化微系统芯片架构研究  

Research on Intelligent and Networked Airborne Microsystem Architectures

作　　者：刘飞阳 赵小冬[1] 李亚晖[1] LIU Fei yang;ZHAO Xiao dong;LI Ya hui(Xi′an Aeronautics Computing Technique Research Institute,AVIC,Xi′an 710068,China)

机构地区：[1]航空工业西安航空计算技术研究所,陕西西安710068

出　　处：《航空计算技术》2018年第5期145-149,共5页Aeronautical Computing Technique

基　　金：航空科学基金项目资助(2017ZC31008)

摘　　要：下一代机载航空电子系统将朝着基于动态异构资源共享的分布式云计算平台方向发展,主要技术特征包括功能综合化、高度智能化、结构微小型化等,实现众多IP模块三维异构集成的微系统芯片技术具有重要的研究意义。针对智能化和网络化的集成微系统芯片架构开展研究,分析系统结构、异构集成、数据通信、智能算法和硬件加速等方面的设计方法,探索高性能片上互连网络、智能硬件结构、面向应用的IP模块布局优化等关键技术,旨在为下一代基于分布式云计算架构的航电系统设计提供理论基础。Next generation airborne avionics systems are developing in the direction of a distributed heterogeneous cloud computing platform with the ability of dynamical information and resource sharing.Main technological properties include：diversely integrated functions,high intelligent ability,and miniaturized hardware structure.The microsystem chip,which realizes the 3D heterogeneous integration of different IP components,is significantly important for future avionics systems.This paper studies on the intelligent and networked integration microsystem architectures,and analyses the design methods in the aspects of system architecture,heterogeneous integration,data communication,intelligent algorithm and hardware accelerator,etc.The key research problems,including high performance on chip network,intelligent hardware accelerator,and application specific IP floorplan optimization scheme,are specifically explored.This paper aims at providing some background technologies for the design of next generation avionics systems with distributed cloud computing architectures.

关 键 词：航空电子系统 集成微系统 片上互连技术 智能硬件平台 IP布局优化 

分 类 号：V247[航空宇航科学与技术—飞行器设计]